Just returned from a weeklong IEEE conference out west where Sony has introduced a new type CMOS sensor. It's based on 3 separate wafers that are bonded together to form a stacked sensor. Wasn't sure if this was public yet (IEEE has strict rules), but found this site 2/3/2018 which dates back to 2017 for technology info.
Here's a link to the technology and some sample images & video.
https://fuse.wikichip.org/news/763/iedm ... echnology/
There's more to it than revealed on this site, but this is a good reference for the general technology idea.
Edit. I found the new reference that is public now.
https://www.sony.net/SonyInfo/News/Pres ... index.html
This uses the stacking wafer technique previously mentioned and places a 14 bit analog to digital converter (ADC) under each pixel!!! The demo chip has 1.46 million 14 bit ADCs and achieves 660 fps!!
Have questions about the equipment used for macro- or micro- photography? Post those questions in this forum.
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